Infineon FF300R17KE4: A High-Performance 1700V IGBT Module for Demanding Industrial Applications
In the realm of high-power industrial electronics, efficiency, reliability, and ruggedness are paramount. The Infineon FF300R17KE4 stands out as a premier 1700V IGBT module engineered specifically to meet the extreme demands of heavy-duty applications. This module encapsulates advanced semiconductor technology, offering a robust solution for systems where operational stability under high voltage and current stress is non-negotiable.
At the core of this module is Infineon's latest IGBT7 chip technology, which sets a new benchmark for performance. The IGBT7 technology is renowned for its significantly reduced VCE(sat) (collector-emitter saturation voltage), which directly translates to lower conduction losses. This efficiency gain is crucial in high-power conversions, as it minimizes heat generation and improves the overall energy efficiency of the system. Furthermore, the module features an integrated Emitter Controlled 7 (EC7) diode in the antiparallel position. This optimized diode exhibits excellent soft recovery characteristics, drastically reducing switching losses and electromagnetic interference (EMI), which is vital for maintaining system integrity and compliance with strict industry regulations.
Designed for a nominal current of 300A and a blocking voltage of 1700V, the FF300R17KE4 is ideally suited for the most challenging environments. Its primary applications include:
Industrial Motor Drives: Providing precise and efficient control for high-horsepower motors in sectors like mining, metal processing, and large-scale pumping systems.
Renewable Energy Systems: Serving as a key component in large solar inverters and wind turbine converters, where handling high DC link voltages is essential.
Industrial Power Supplies and UPS: Ensuring stable and reliable power conversion and backup for critical infrastructure.
The module's construction is designed for maximum durability. It utilizes low-inductance design and AL2O3 (Alumina Oxide) ceramic substrates with direct copper bonding, ensuring excellent electrical isolation and superior thermal cycling capability. This robust mechanical design allows it to withstand the thermal stress encountered in daily start-stop cycles and overload conditions, thereby extending the system's operational lifespan.
Ease of integration is another key benefit. The module employs a press-fit pin (HPP) interface for the main terminals. This technology enables a solder-free, reliable, and automated assembly process, reducing manufacturing time and potential failures associated with manual soldering of high-power connections.
ICGOO
The Infineon FF300R17KE4 is a top-tier 1700V IGBT module that combines cutting-edge IGBT7 technology with a rugged package. Its ultra-low VCE(sat) and optimized diode deliver exceptional efficiency and reliability, making it an indispensable component for engineers designing next-generation high-power industrial systems that cannot afford downtime.
Keywords:
1700V IGBT Module
IGBT7 Technology
Low Conduction Losses
Industrial Motor Drives
Press-Fit Pin (HPP)
